Products and Services

We provide innovative, creative solutions for new technologies and complex processes. Electronics Recovery Service brings our experience in a broad range of industries to your problem, creating solutions on time and within budget. Known as the electronic engineer's best solution resource, we have supported designs for many of the largest high tech manufacturing firms in the US.


Our superior Products and Services include:

  • Advanced Packaging Design and Materials Selection
  • Area Device rework, recovery and failure analysis
  • New process/product implementation
  • Manufacturing Engineering Consulting

All workmanship is produced using the following IPC Standards(current revisions):

  • IPC 7711/21 Rework and Repair
  • IPC-A-610 Workmanship Standards
  • IPC TM650 Test method
  • IPC-A-600 Acceptability of Printed Circuit Boards


Electronics Recovery Service has exceptional, innovative solutions for BGA rework projects.

  • We apply quality checks throughout the rework operation reducing variability.
  • We offer custom profiling with consideration to all thermal relationships including: board configuration, thickness, density, pcb material, adjacent heat sensitive components...no one size fits all profiling.
  • Critical Parameters
    • Moisture sensitivity
    • Matching flux Chemistries
    • Analysis of critical temperatures/times
    • Component manufacturers specifications
  • Extensive expertise controlling profiling variables such as:
    • Top Heat
    • Bottom Heat
    • Airflow
    • Time
    • Co-planarity
    • Thermal Characteristics/Rating System
    • Nozzle Selection
    • Site Prep
    • Preheat
    • Soak
    • Reflow/Peak
    • Cool Down
  • Printed X-Ray of each reworked device included with order.
  • Digitally captured X-Ray and endoscopic results available.
  • Review of Board layout/land geometry with suggestions for changes if needed.

 


If you need economical and creative packaging solutions from wafer through system, call Electronics Recovery Service. We support the following technologies:

  • COB
  • MEMS
  • MCM
  • Pb Free
  • Anisotropic Techniques and Materials
  • Wirebonding
  • DFX
  • Material selection and design for harsh environments

 


Electronics Recovery Service offers Original Equipment Manufacturers and Contract Manufacturers additional technical support. This service is offered for those who require a complete solution or as a scaleable addition to your current skill set. Our support services include:

  • New product/process implementation
      1. Equipment recommendations
      2. Supplier recommendation and certification
      3. SPC
      4. Master parts list
      5. Bill of materials
      6. Assembly instructions/documentation
      7. Training of Technical Personnel
  • Product/process analysis for cost reduction/yield improvement
  • Implementation of demand-flow or work cell environment
  • Evaluation and selection of capital equipment
  • Cost of Quality analysis
  • Failure Analysis

 

Testing/Quality Tools: IR Testing
  Endoscope
  X-Ray w/5 Axis Rotation/ Digital Capture
   
Production/Rework: Split Beam BGA Rework Station
  Automated Dispenser
  Stencil Printer
  Thermosonic Wire Bonder
  Wire Pull Test
  UV Chamber
  Die Placement
  Reflow Ovens

We make sure the customer returns...and the product doesn't!

Got questions? Call us today- we are happy to help!  970-449-9468

Electronics Recovery Service
640 WCR 46
Berthoud, Colorado  80513
970-449-9468

 

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