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Products and Services
We provide innovative, creative solutions for new technologies
and complex processes. Electronics Recovery Service brings
our experience in a broad range of industries to your problem,
creating solutions on time and within budget. Known as the
electronic engineer's best solution resource, we have supported
designs for many of the largest high tech manufacturing firms
in the US.
Our superior Products and Services include:
- Advanced Packaging Design and
Materials Selection
- Area Device rework, recovery and
failure analysis
- New process/product implementation
- Manufacturing Engineering Consulting
All workmanship is produced using the following IPC Standards(current
revisions):
- IPC 7711/21 Rework and Repair
- IPC-A-610 Workmanship Standards
- IPC TM650 Test method
- IPC-A-600 Acceptability of Printed Circuit Boards
Electronics Recovery Service has exceptional, innovative solutions
for BGA rework projects.
- We apply quality checks throughout
the rework operation reducing variability.
- We offer custom profiling with
consideration to all thermal relationships including: board
configuration, thickness, density, pcb material, adjacent
heat sensitive components...no one size fits all profiling.
- Critical Parameters
- Moisture sensitivity
- Matching flux Chemistries
- Analysis of critical
temperatures/times
- Component manufacturers specifications
- Extensive expertise controlling profiling variables such
as:
- Top Heat
- Bottom Heat
- Airflow
- Time
- Co-planarity
- Thermal Characteristics/Rating
System
- Nozzle Selection
- Site Prep
- Preheat
- Soak
- Reflow/Peak
- Cool Down
- Printed X-Ray of each reworked
device included with order.
- Digitally captured X-Ray and
endoscopic results available.
- Review of Board layout/land geometry with suggestions
for changes if needed.
If you need economical and creative packaging solutions from
wafer through system, call Electronics Recovery Service. We
support the following technologies:
- COB
- MEMS
- MCM
- Pb Free
- Anisotropic Techniques and
Materials
- Wirebonding
- DFX
- Material selection and design for harsh environments
Electronics Recovery Service offers Original Equipment Manufacturers
and Contract Manufacturers additional technical support. This
service is offered for those who require a complete solution
or as a scaleable addition to your current skill set. Our
support services include:
- New product/process implementation
- Equipment recommendations
- Supplier recommendation and
certification
- SPC
- Master parts list
- Bill of materials
- Assembly
instructions/documentation
- Training of Technical Personnel
- Product/process analysis for cost
reduction/yield improvement
- Implementation of demand-flow or
work cell environment
- Evaluation and selection of capital
equipment
- Cost of Quality analysis
- Failure Analysis
| Testing/Quality Tools: |
IR Testing |
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Endoscope |
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X-Ray w/5 Axis Rotation/ Digital Capture |
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| Production/Rework: |
Split Beam BGA Rework Station |
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Automated Dispenser |
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Stencil Printer |
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Thermosonic Wire Bonder |
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Wire Pull Test |
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UV Chamber |
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Die Placement |
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Reflow Ovens |
We make sure the customer returns...and
the product doesn't!
Got questions? Call us
today- we are happy to help! 970-449-9468
Electronics Recovery Service
640 WCR 46
Berthoud, Colorado 80513
970-449-9468
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